| http://www.w3.org/ns/prov#value | - The device may further include at least one other layer, such as a buffer layer positioned between the substrate and the bottom cladding layer, a highly doped contact layer positioned between the top cladding layer and the top electrode, a capping layer positioned on top of the top cladding or contact layer, and some other layers depending on the construction of the device, as is well-known in the
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