| http://www.w3.org/ns/prov#value | - The placement objective is to minimize some functions of the chip level interconnections, subject to physical constraints and requirements, such as size and form factor of the macros, input/output (I/O) pin location in the macros, and chip I/O drivers, power supply partitioning and noise isolation for logic and DRAM, DRAM macro distribution according to capacity and I/O width, layout of on-chip gl
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