| http://www.w3.org/ns/prov#value | - The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to...http://www.google.com/patents/US7851922?utm_source=gb-gplus-sharePatent US7851922 - Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesAdva
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