| http://www.w3.org/ns/prov#value | - henium layer formation for copper film depositionUS72650481 Mar 20054 Sep 2007Applied Materials, Inc.Reduction of copper dewetting by transition metal depositionUS740498522 May 200329 Jul 2008Applied Materials, Inc.Noble metal layer formation for copper film depositionUS742940210 Dec 200430 Sep 2008Applied Materials, Inc.Depositing a barrier layer on the substrate, such as a titanium or tantalum c
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