| http://www.w3.org/ns/prov#value | - The copper 1360 is interconnected with lower portions of glass layer 1354 for forming the circuit for driving the copper actuator. [1031] The nozzle chamber 1310 can be constructed using the standard MEMS processes including forming the various layers using the sacrificial material such as silicon dioxide and subsequently sacrificially etching the lower layers away. [1032] Subsequently, wafers tha
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