| http://www.w3.org/ns/prov#value | - This liquid phase ensures optimum wetting of the polishing plate, on the one hand, and the surface to be polished (e.g. the wafer), on the other hand. [0018] Furthermore, the polishing fluid according to the invention contains polycrystalline diamond powder, the particle size of which is preferably below approximately 1 ??m, in particular between 0.05 and 1 ??m, and especially between 0.1 and 1 ??
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