| http://www.w3.org/ns/prov#value | - The process parameters and materials, including the underfill, masking and cleaning materials used, have been shown to have a synergistic effect that has unexpectedly increased thermal cycle fatigue resistance to a level at which a flip chip processed in accordance with this invention is capable of reliably withstanding at least 1000 one-hour cycles between -40??? C. and +150??? C., a capability n
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