| http://www.w3.org/ns/prov#value | - The chip carrier 1 has a package structure wherein a thin wiring layer 13 comprising a conductor layer of aluminum (Al) or copper (Cu) for example and an insulating layer of a polyimide for example is formed on a main surface of a package substrate 2 of a ceramic material such as mullite, and a semiconductor chip 5 is face down bonded through solder bumps 4 onto electrodes 14 formed on the thin wi
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