| http://www.w3.org/ns/prov#value | - Therefore, there is a problem that two scans of the entire surface of the wafer are required and the inspection time is lengthened. [0022] Japanese Patent No. 3187827 has disclosed a pattern inspection method and a pattern inspection apparatus, which have a die comparison circuit and a cell comparison circuit, classifies an image into a part for the die comparison and a part for the cell compariso
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