| http://www.w3.org/ns/prov#value | - The next stage of the process consists of bonding of the wafer to a support 680, such as glass, ceramic, or thin stainless steel. (If the support is transparent to infrared radiation, downstream front-to-back alignments are facilitated, but the alignments can also be carried out by careful registration to the support edges.) The processed front side is bonded to the support 680 using a suitable ad
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