| http://www.w3.org/ns/prov#value | - This invention relates to the assembly andpackaging of microelectronic devices, including semiconductor circuit chips, printed circuit boards, thin-film networks (TFN's), and multichip circuit modules; and more particularly to novel means for interconnecting such devices and modules,electrically and/or thermally.BACKGROUNDThe effort to provide more reliable, more cost-effective means for interconn
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