| http://www.w3.org/ns/prov#value | - Therefore, there is a limit as to how thick the passivation layer can be made.Embodiments of the present invention as illustrated in FIGS. 2-14 have solved the concern associated with thermal stresses occurring at the perimeter of the solder balls, and the dilemma associated with using a passivation layer (e.g., polyimideor BCB) to absorb stresses that is not too thick to cause warping of the semi
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