| http://www.w3.org/ns/prov#value | - The interconnect layer can also comprise a material such as aluminum; an aluminum-silicon binary alloy plug containing less then 2.0 wt % of silicon, as to ensure a silicon-eutectic temperature of more than 567??? C.; an aluminum-copper binary alloy plug containing less than 6.0 wt % of copper to ensure a silicon-eutectic temperature of more than 548??? C.; another binary aluminum alloy plug havin
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