| http://www.w3.org/ns/prov#value | - The copper foil for printed wiring boards according to the present invention, which is prepared by the foregoing method, is covered with a metal chromium layer formed, on at least one side thereof, by such a sputtering technique, except for a portion with a sharp and deep incision such as that in the copper foil on which a pinhole is formed and the shady side, with respect to the target, such as t
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