| http://www.w3.org/ns/prov#value | - This semiconductor device is a semiconductor device to which a lead cut type SON (Small Outlined Non-leaded Package) is applied, and includes a semiconductor chip 1, a die pad 2 which supports the semiconductor chip 1, a plurality of leads 3 to be electrically connected to the semiconductor chip 1, and an encapsulation resin 4 in a generally truncated four-sided pyramid shape for encapsulating the
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