| http://www.w3.org/ns/prov#value | - The method for fabricating the electronic device of a second comparative example will be described as follows with reference to FIGS. 4(a) to 4(c) by taking as an example the case where a via hole is formed by dry etching an insulator film on a wiring and then the reaction product deposited on walls or other portions of the via hole is removed by using a cleaning solution having a relatively high
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