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http://webisa.webdatacommons.org/309380350
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http://www.w3.org/1999/02/22-rdf-syntax-ns#type
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The trench pattern is extended to the depth of the substrate 10 by another conventional anisotropic dry etching process, such as RIE or plasma etching, selective to the material constituting the substrate 10.
http://www.w3.org/ns/prov#wasQuotedFrom
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