About: http://webisa.webdatacommons.org/311987715

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 7a is a side view of a stacked flip-chip die assembly 800a using double-sided flip-chip dies which increases the number of bond pads (die periphery area) available within a given footprint.
http://www.w3.org/ns/prov#wasQuotedFrom	google.fr