| http://www.w3.org/ns/prov#value | - Brevet US6232146 - Semiconductor device including combed bond pad opening, assemblies and methods - Google???BrevetsRecherche Images Maps Play YouTube Actualit???s Gmail Drive Plus ??Connexion Recherche avanc???e dans les brevets BrevetsA semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer.
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