| http://www.w3.org/ns/prov#value | - Next, fill dielectric 600 is formed on the structure illustrated in FIGS. 5A-5C, resulting in the structure illustrated in the top view of FIG. 6B and the cross-sectional views of FIGS. 6A and 6C. The dielectric 600 may comprise, for example, silicon dioxide, and may be formed by depositing the dielectric 600 and performing a planarization process such as CMP.
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