About: http://webisa.webdatacommons.org/315947404

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Electrically conductive balls or bumps (typically metal, such as gold or solder) 212 are mounted on interconnect pads 213 on the die.
http://www.w3.org/ns/prov#wasQuotedFrom	freshpatents.com