PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Accordingly, in one embodiment, the present invention is a method of manufacturing a semiconductor device comprising the steps of providing a substrate, and forming a via through a top-side of the substrate.
http://www.w3.org/ns/prov#wasQuotedFrom
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