About: http://webisa.webdatacommons.org/31690852

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	chip and the microcircuit substrate; FIG. 2 is a cross-sectional view of a thin film flat pack in which the pyrotechnic material is used as the bonding agent between the microcircuit and the substrate; FIG.
http://www.w3.org/ns/prov#wasQuotedFrom	freepatentsonline.com