About: http://webisa.webdatacommons.org/317071727

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In assemblies such as BGAs, heat generated from the chip is conducted to the heatsink via the die encapsulant, and subsequently dissipated to the outside by convection.Die-level localized hot spots create a unique challenge.
http://www.w3.org/ns/prov#wasQuotedFrom	electroiq.com