| http://www.w3.org/ns/prov#value | - DETAILED DESCRIPTION OF THE INVENTION [0049] All publications cited herein are hereby incorporated by reference. [0050] The present invention relates to a polishing composition which has some benefits including capability of subjecting a substrate to be polished having dents and projections on its surface to planarization efficiently and at a high level. [0051] The present invention also relates t
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