| http://www.w3.org/ns/prov#value | - Also, if desired portions of the circuits may be plated with other metals such as gold, to enhance solderability or bondability of components thereon, the full thick metal deposit may be provided directly in one step with a direct full build electroless plating bath such as MacDermid 9620 or Photocircuits CC4 or other commercially available copper electroless plating baths of the copper sulfate-fo
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