| http://www.w3.org/ns/prov#value | - Alternatively, the bonding pad 22 may be formed of a chromium layer having a thickness of between 0.01 and 0.7 ??m, and preferably of between 0.03 and 0.7 ??m, on the pad 16, principally made of copper, typically called a copper pad, exposed by the opening 14 a, a sputtered seed layer, made of palladium, having a thickness of between 0.03 and 1 ??m, and preferably of between 0.03 and 0.7 ??m, on t
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