| http://www.w3.org/ns/prov#value | - l stack structure including at least one first device chip with a first plurality of input/output (I/O) pads and at least one second device chipwith a second plurality of I/O pads, and a common circuit board to which the wafer level stack structure is connected.Another exemplary embodiment of the present invention is a method of forming a system-in-package for containing a wafer level stack struct
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