| http://www.w3.org/ns/prov#value | - ly conductive adhesive material as indicated by process block 303, (f) bonding a wire from the die to the at least one lead as indicated by process block 404, (g) installing a window onto the molded lead-frame by applying a sealant such as a UV-curable epoxy as indicated by process block 505, thereby forming the at least one leadless semiconductor packaging apparatus 2000, (h) marking, by laser te
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