| http://www.w3.org/ns/prov#value | - Also, in order to improve the adhesiveness of the second thin metal film 16 to a solder bump, which may be formed on a chip to be stacked, the second thin metal film 16 can be formed by selecting the metallic material from among gold, platinum, titanium, silver, copper, bismuth, tin, nickel, chromium, zinc, and other suitable metals and combinations thereof depending upon the type of the solder bu
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