| http://www.w3.org/ns/prov#value | - Alternatively, in embodiments such as depicted in FIG. 10, in which the substrate face is immersed in an electropolishing bath in which a cathode is located, various methods of field shaping can be used as known in the art (e.g., as described in U.S. Pat. No. 6,402,923, ???Method and Apparatus for Uniform Electroplating of Integrated Circuits Using a Variable Field Shaping Element???, issued Jun.
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