PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • A semiconductor device as claimed in claim 1, wherein the intrinsic stress that occurs while forming the film is a compressive stress of 8???109 dyne/cm2 or less or a tensile stress of 3???109 dyne/cm2 or less.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com