| http://www.w3.org/ns/prov#value | - As described above, in the through-hole electrode substrate 300 shown in the third embodiment, it is possible to externally discharge the gas discharged from within the through-hole electrode 14 which is formed by filling a metal such as copper (Cu) into the through-hole 12 which is formed in the silicon substrate 11, by arranging these gas discharge holes 302.
|
