| http://www.w3.org/ns/prov#value | - A thermally conductive material such as copper or aluminum, for example, can be deposited or applied to the upper surface 28 (2) of the die 12 a (2), 12 b (2) within the confines of the standoff(s) 16 (2) to form a heat sink 31 (2) for dissipating heat from the die 12 a (2), 12 b (2) during operation.
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