| http://www.w3.org/ns/prov#value | - Depending on the application, the die can be configured as a memory device, as a vertical cavity surface emitting laser device (VCSEL), or in any other conventional configuration. [0035] If the semiconductor component being fabricated is an interconnect, the substrate can comprise a semiconductor material such as monocrystalline silicon, germanium, silicon-on-glass, or silicon-on-sapphire.
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