| http://www.w3.org/ns/prov#value | - FIG. 3A is a cross-sectional side view of a microelectronic workpiece 202 (e.g., a semiconductor or microelectronic wafer), including the substrate 22, the substrate pads 30 and 132, and the insulating layer 46 after it has been deposited on the substrate 22 and etched to create openings 241 a and 241 b.
|
