About: http://webisa.webdatacommons.org/324446300

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In one embodiment die 104 and microchannel heat exchanger 102 are silicon and solder 106 is an interstitial solder such as a low-melting point indium solder for example.
http://www.w3.org/ns/prov#wasQuotedFrom	google.ca