About: http://webisa.webdatacommons.org/326500574

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	When patterns of multi-layer Cu wirings are formed by making patterns such as grooves (trench) and holes (via) below a predetermined resolution limit using a dual damascene method, the following problems occur.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com