| http://www.w3.org/ns/prov#value | - The memory chip of the stack of the SOI structure layers (L1, L2, L3, L4, . . . ) is fixed to the mount board MB by die bonding or the like, and the electrodes EL such as lands formed on the mount board MB and the pad PAD of each layer of memory chip are connected by wire bonding or the like.
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