| http://www.w3.org/ns/prov#value | - For those embodiments utilizing a metal layer such as to form a Schottky barrier contact or a metal-insulator-metal rectifying structure various types of metal deposition equipment and techniques such as PECVD, CVD, metalorganic CVD (MOCVD), sputter deposition, evaporation, and electro-deposition also may be utilized.
|
