About: http://webisa.webdatacommons.org/329428192

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	During the packaging process, the thermal stresses experienced from curing materials such as encapsulants and die attach adhesives further contributes to potential failures.
http://www.w3.org/ns/prov#wasQuotedFrom	electroiq.com