| http://www.w3.org/ns/prov#value | - After the protruding regions 180 of the metal traces 178 are connected to the tin-containing layer 70 on the bottom surface of the inner leads 68 using a thermal pressing process, a polymer material 74, such as epoxy or polyimide, can be formed between the semiconductor chip 182 and the tin-containing layer 70 on the bottom surface of the inner leads 68, and enclosing the metal traces 178.
|
