| http://www.w3.org/ns/prov#value | - During this curing process, pressure should be applied to the Invar film 49 by a clamp, a stack of weights, or other method suitable to apply pressure uniformly (not shown) over the thin film of Invar 49 to press it down securely and uniformly against the top major surface 23 of package P. The force applied should be sufficient to improve the bonding without damaging package P or integrated circui
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