| http://www.w3.org/ns/prov#value | - Further, in the method of fabricating the multilayer PCB according to the first embodiment of the present invention, because a metal carrier having a low CTE, such as SUS304, Invar, or Kovar, is used in order to protect the substrate from deformation, including extension or warping, due to the change in atmospheric temperature or the difference in process temperatures, the PCB can be stably fabric
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