| http://www.w3.org/ns/prov#value | - Further, unlike a structure disclosed in Japanese Non-examined Patent Publication No.9-503312 (1997) which is complicated and has bent parts, this simple laminated boards 8 a, 8 b, and 8 c are easily manufactured and inexpensive because they require only laminating and burning. [0040] Further, the semiconductor sensor element 2 is made of a semiconductor such as silicone and its thermal expansion
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