| http://www.w3.org/ns/prov#value | - used in the present invention are thermosetting resins such as epoxy resins, vinyl ester resins, unsaturated polyester resins, phenol resins, benzoxazine resins, etc., thermoplastic resins such as polyethylene resins, polyamide resins, polypropylene resins, ABS resins, polybutylene telephthalate resins, polyacetal resins, polycarbonate resins, etc., and denatured resins obtained by making these r
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