| http://www.w3.org/ns/prov#value | - Surfaces of metals, semiconductors, oxides, nitrides, sulfides, and others are terminated with OH, NH, NH2, SH, SeH, AsH, and other fragments., and combinations of these terminations at well-controlled surface concentrations are tailored by using CRISP. For example, in an exemplary embodiment, silicon surfaces are terminated by a combination of H, OH, NH, and NH2 by conducting a CRISP stage with c
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