| http://www.w3.org/ns/prov#value | - Further, the present invention is directed to a mounting structure of an electronic component comprising: a flat shaped substrate; a first lead terminal connected to one end of the substrate by grasping the substrate, and led out toward an outside of the substrate so as to be parallel to a surface of the substrate, and a connecting side except a grasping portion and inserting portion side to an ex
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