| http://www.w3.org/ns/prov#value | - Further, the present invention is a method for manufacturing a bump-attached wiring circuit board in which bumps are formed on a wiring circuit, comprising the steps of: (aa) laminating a protective film over the wiring circuit formation side of a metal foil having a thickness equal to the sum of the thickness of the wiring circuit and the height of the bumps to be formed on the wiring circuit, an
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