| http://www.w3.org/ns/prov#value | - Further, the conductive barrier metal layers (anti-diffusion films) 5 and 60 are interposed on the interfaces between the upper and lower electrode films 6 and 9 and the conductive materials mainly composed of silicon and aluminum, which are electrically connected with the electrode films 6 and 9, for preventing mutual diffusion between silicon and platinum and between aluminum and platinum. [0014
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